Printed Circuit Board Fabrication Services

General Capabilities

Circuit Board Construction

Rigid Boards / Flex Circuits / Rigid Flex Single-Sided / Double-Sided / Multi-Layer Blind / Buried / Micro Vias Fine Line / High Density Controlled Impedance LPI Soldermask (Green, Black, Blue, Red, White) Solder Mask Over Bare Copper (SMOBC) Silkscreen (White, Black, Yellow, Red, Blue) HASL - Leaded Solder Tin / Nickel HASL - Lead Free Solder: Electroless Soft Gold
Wire Bondable Soft Gold
Nickel Flash Gold
Electroless Nickel
Immersion Gold OSP
Electrolytic Nickel / Hard Gold and Selective Gold
Immersion Silver
Carbon Ink
ENIG

Please call for availability of specific requirement.

Materials

FR-4 (Tg - 135C, 145C, 170C) Rogers^® (Ultralam 2000, RO4350, RO4003) Polyimide Teflon^TM Black FR-4: Arlon^TM AR350
Getek Copper Clad Thermal Substrates
Hybrid (Rogers^® and FR-4) BT Epoxy
Nelco^® 4013

Please call for availability of specific requirement.

Number of Board Layers

Quality and Testing

Bare Board Electrical Test / Flying Probe Inspect to IPC Class III Continuity Resistance - 10 to 20 Ohms

Additional Services Provided

Printed Circuit Board Layout Conceptual Engineering / Design Assistance Reverse Engineering Gerber Editing File Review Design Review Printed Circuit Board Assembly (Kitted or Turnkey): Conformal Coating
Box Build
Testing and Calibration
Programming
Custom Cables
Custom Enclosures

Turnaround Time: Standard - 5 Days, 10 Days, 15 Days
Rush 24, 48, 72 Hour Turnaround Available

Additional Information

Industry Focus (But not limited to)

Aerospace Automation and Robotics Chemical Educational Institutions Electronic Product Manufacturers Entrepreneurial Start-ups Gas Detection Industrial Control: Medical
Military / Defense
Nuclear Power
Optical
Research and Development
Semiconductor
Telecommunications
Test and Measurement

Services

Print This Page