Conceptual Design & Engineering / PCB Layout / Flex-Rigid Board

Conceptual Design & Engineering / PCB Layout / Flex-Rigid Board
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Conceptual Design & Engineering / PCB Layout / Flex-Rigid Board

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Project Description
  • Developed from Concept in Conjunction with Carnegie Mellon University
  • Wearable Computer for Potential Military Application
  • Mixed Technology PCB Consisting of Through-hole and SMT Components
  • Flex Rigid Printed Circuit Board
  • 10 Layer Board
  • 564 Components Total
  • Two 256 Pin BGAs, One 180 Pin BGA, Three 96 Pin BGAs
  • PCMCIA Slot
  • Compact Flash Slot
  • USB, DVI, RS232, 1394 Connectivity
  • Stereo Audio Jacks
  • Considered Cutting Edge State-of-the-Art Technology at Time of Project
  • Project also Included the Design of an Optional Programmable "Smart" Power Supply / Battery Pack
  • Full Documentation Package Supplied to Customer Including Gerber Files, Drill Files, Schematic Diagram Drawings, Bill of Materials, PCB Fabrication and Assembly Drawings, Component Auto-Place Files, and Test Files
Capabilities Applied/Processes
  • Printed Circuit Board (PCB) Conceptual Design / Engineering
  • Printed Circuit Board (PCB) Layout
  • Printed Circuit Board (PCB) Fabrication
  • Printed Circuit Board (PCB) Turnkey Assembly
  • Design for Manufacturability (DFM)
  • Design for Assembly (DFA)
  • Design for Test (DFT)
Equipment Used to Manufacture Part
  • Automated Pick and Place
  • Reflow Solder
  • X-Ray Inspection of BGA Components
Overall Part Dimensions
  • Top PCB Approximately 5.870" X 2.875" X 0.062"
  • Bottom PCB Approximately 4.000" X 2.770" X 0.062"
  • Overall Product Size: 6" X 3" X 1"
Tightest Tolerances
  • 0.005" Minimum Trace Width
  • 0.005" Minimum Clearances
  • 0.008" Minimum Via Size
Material Used
Rigid FR-4 with Internal Kapton® Layers
Material Finish
ENIG
Industry for Use
Educational Institution / Research & Development
Volume
Turnkey Prototype Assembly of a Quantity of 10
Standards Met
PCB Layout and Manufacturing in accordance to IPC Standards
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